FREMONT, Calif., Nov. 15, 2022 /PRNewswire/ -- Lam Research Corp. (Nasdaq: LRCX) today announced that it has completed the acquisition of SEMSYSCO GmbH, a global provider of wet processing ...
As the demand for advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) continues to outpace supply, the semiconductor packaging equipment supply chain is increasingly optimistic ...
SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...
Taiwan-based AblePrint Technology, a key supplier of advanced packaging defoaming equipment for major clients including TSMC, ...
Continued innovation in advanced packaging opens a clearer path to the outcomes the industry prioritizes. By tightening the physical distance between compute, memory, and interconnect, chipmakers ...
TOKYO/SEOUL, March 31 (Reuters) - South Korea's Samsung Electronics Co Ltd (005930.KS), opens new tab is considering setting up a chip packaging test line in Japan, five people said, to bolster its ...
The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...
The news is coming from TheElec, with their sources saying Samsung's Advanced Package (AVP) team will be providing an interposer and I-Cube -- its 2.5D package -- to NVIDIA. Other companies will ...
SANTA CLARA, Calif. and SINGAPORE, Nov. 18, 2024 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced plans to expand its global EPIC* innovation platform with a new collaboration model ...
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