Most 3D design software requires visual dragging and rotating—posing a challenge for blind and low-vision users. As a result, ...

The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.

When Amber Jae Slooten, the now-creative director of digital fashion house The Fabricant, was studying at the Amsterdam Fashion Institute (Amfi) in 2013, she wanted to create digital-only clothes but ...

Yield and cost have always been critical factors for both manufacturers and designers of semiconductor products. It is a continuous challenge to meet targets of both yield and cost, due to new device ...

The use of Artificial Intelligence (AI) into 3D product design is increasingly impactful, especially during the initial stages of image creation, brainstorming and conceptualization. A variety of AI ...

Have you ever imagined turning your ideas into physical objects with just a few clicks? Thanks to tools like Tinkercad, what once seemed like science fiction is now an accessible reality for anyone ...

When brands design and sample digitally, achieving a true-to-life look is the goal. However, for many garments, a realistic look comes down to what’s not visible: the interlinings. Interlinings, or ...

Cadence is trying to automate more aspects of the chip design process with Integrity 3D-IC, a suite of software tools it says can help engineers develop faster, less power-hungry chips using 3D ...

Frank is a social media journalist for the CDW family of technology magazine websites. Part of the appeal of 3D printing is witnessing ideas come to life. As the technology becomes less expensive, ...

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...